Koch Chemie Micro Cut Pad 76 x 25 mm - Polishing Pad Purple

High-quality special polishing pad designed to remove light scratches, holograms, and polishing marks using Micro Cut M3.02 and Micro Cut & Finish P3.01. A low height of 23 mm generates low torsional forces, allowing for very good handling and maximum stability. The special density of the foam material provides lasting firmness under moderate pressure during polishing. The optimized reticulation (open cells) and cell count contribute to a durable final shine and very good hygiene factors. The milled edge allows greater flexibility of the pad for better adaptation to contours. Color-coded designs matching the pastes ensure procedural safety.

• Firmness under moderate pressure: 10.
• Abrasiveness: 5.