Koch Chemie Micro Cut Pad 150 x 25 mm - Purple Polishing Pad

High-quality special polishing pad for removing light scratches, holograms, and polishing marks using Micro Cut M3.02 and Micro Cut & Finish P3.01. The low height of 23 mm generates low torsional forces, allowing for excellent handling and maximum stability. The special density of the foam material ensures long-lasting rigidity during polishing with reasonable compression. Optimized reticulation (open cells) and the number of cells contribute to a permanent high gloss finish and very good hygiene factors. The machined edge allows for greater pad flexibility to better adapt to contours. The color variants suited to the pastes ensure process safety.

• Rigidity under reasonable compression: 10.
• Abrasiveness: 5.