Koch Chemie Micro Cut Pad 126 x 25 mm - Polishing Pad Purple

High-quality special polishing pad for the removal of light scratches, holograms, and polishing traces using Micro Cut M3.02 and Micro Cut & Finish P3.01. The low height of 23 mm generates low torque forces, allowing for very good handling and maximum stability. The special density of the foam material ensures long-lasting firmness under relative compression during polishing. The optimized reticulation (open cells) and the number of cells contribute to a permanent final shine and very good hygienic factors. The milled edge allows for greater flexibility of the pad, enabling better adaptation to contours. The color variations that match the pastes ensure process safety.

• Firmness under relative compression: 10.
• abrasiveness: 5.